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    Breaking News

    Omet to Highlight Packaging at Open House

    The event, scheduled for March 20-21, will feature the launch of the Varyflex V4 Offset.

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    02.28.17
    Packaging will be the main topic of Omet’s next Open House, scheduled for March 20-21, 2017. Important global players of the packaging sector will be welcomed at Omet headquarters in Lecco for the official presentation of the new Varyflex V4 Offset. The company says the product is the only solution in the entire mid-web market with fully automatic offset technology by sleeve, which assures extreme flexibility and user-friendly operations.
     
    The flexible packaging market keeps on growing, particularly with strong demand for hybrid technologies that are able to satisfy not only the need for high printing quality but also the need for high-density color applications. The Varyflex V4 Offset can satisfy both this requests due to the combination of high-quality offset technology and newly designed flexo stations.
     
    This printing combination will be shown during the event, named “Your Passport to Packaging,” in a live demonstration where the new 33”4/8-wide press, with maximum mechanical speed of 400 m/m, will highlight all its potential capabilities. The Offset groups feature sleeve technology, which allows a complete repeat changeover in few minutes.
     
    The Varyflex V4 Offset has been designed to print either with “Wet-On-Dry” configuration, mounting UV lamps in-between the printing stations, or “Wet-On-Wet” with UV drying or Electron Beam curing at the end of the line.
     
    “We chose to show the electron beam curing system because we believe it can provide extreme drying efficacy in packaging printing production,” explained Marco Calcagni, Omet commercial director, especially with complex jobs and food packaging. “The Varyflex V4 Offset is highly competitive in this ever-changing market, where job runs are shorter and shorter and the alternative printing solutions, like rotogravure and CI flexo machines, add higher production costs to low flexibility and limited configurations.”
     
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