Nestle Featured at RadTech Packaging Event

Posted on March 22, 2012 @ 11:21 am

Dr. Stephen P. Klump, Nestlé Quality Assurance Center, is headlining a special day of presentations on the fast emergence of UV and EB technologies in printing and packaging applications, at RadTech 2012, April 30 in Chicago, IL.

At the event, Dr. Klump will address Nestlé’s Approach to Packaging Safety and Compliance: Nestlé Inks Guidance Document and the Suisse Ordinance on Inks. In addition to Dr. Klump, issues presented at the event include global and regional regulatory requirements, new materials, EB technologies, and UV inkjet for flexible packaging and labels.

RadTech 2012 also features a technology exhibition and special sessions on sustainability, LEDs, and EHS basics for UV/EB. End users of UV and/or EB may be eligible for discounted or free admission to the event. Please visit www.radtech2012.com for details.