The partnership will focus on the development and commercialization of new organic semiconductors and dielectrics for use in CMOS (complementary metal oxide semiconductor)-analog printed circuits. The partners intend to develop these materials as well as a printed prototype CMOS circuit within the next three years.
“Polyera has in-depth know-how in the design and synthesis of semiconductors and dielectrics as well as in transistor physics. This perfectly complements the expertise that BASF has built up in this area by itself as well as through a network of cooperations,” said Dr. Peter Eckerle, project manager at BASF Future Business. “We are now well positioned to develop superior new material systems and satisfy the growing market demand.”
“We are delighted about our cooperation with BASF. In addition to our combined strengths in developing new material systems, BASF’s expertise in scaling up new products quickly and bringing them to market is very important to us. We are confident that our partnership will greatly enable the commercialization of printed electronics, as lack of superior materials is acknowledged to be one of the major bottlenecks in the industry,” said Philippe Inagaki, co-founder of Polyera Corporation.
Polyera Corporation is headquartered at the Illinois Science and Technology Park, Skokie, IL. Since its founding in August 2005 as a start-up from Northwestern University, Polyera has become a leading developer of materials and technologies for the printed electronics industry.