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NPIRI Technical Conference Begins Today

By David Savastano | 10.02.13

Keeping up to date on technology and trends is critical for any business, and the ink industry is no exception. In order to provide ink industry leaders the information they need on technology and growing markets, the National Association of Printing Ink Manufacturers (NAPIM) annual National Printing Ink Research Institute (NPIRI) Technical Conference offers a wide variety of educational and networking opportunities.
This year’s Technical Conference is no exception. With an eye on key topics such as packaging, regulations and new technologies such as conductive inks, this year’s NPIRI Technical Conference, which begins today and runs through Friday at the Hilton Chicago – Indian Lakes Resort, offers attendees the information they may need to keep their businesses growing.

Today’s Opening Session begins this afternoon with the Keynote Address. Jeff Wettersten, of Karstedt Partners will discuss “Packaging: Evaluation of Vertical Markets and Key Applications,” a look at critical trends and drivers in the packaging market. Mr. Wettersten will present the results of an in-depth study of the brand owners, retailers and consumers value chain and its influence on packaging.

Brad Bergey, executive director of NAPIM, will follow with “State of the Industry.” Mr. Bergey will recap the past year’s results for the ink industry, as well as add new information on the early results for 2013.

Diane Parisi of Flint Group will analyze “Printing Ink Raw Materials Supply Update.” Ms. Parisi will bring her insights into the cost and supply trends for many key raw materials, including titanium dioxide, nitrocellulose, acrylic acid, vegetable and petroleum oil products and pigments.

Today’s conference session will conclude with a two-and-a-half-hour reception, including Tabletop exhibits and Supplier Spotlights.

The Tabletop exhibitors include:
• Air Products & Chemicals, Inc.
• Buhler, Inc.
• BASF Corporation
• Brilliant Group, Inc.
• BYK USA, Inc.
• EMI Engineered Mills, Inc.
• Evonik Tego
• J Color Chemicals
• Lawter
• PCT Engineered Systems
• Polimeros Sinteticos
• Shamrock Technologies, Inc.
• SpeedyDry
• United Mineral & Chemical
• Wercs, Ltd. and Wercs Professional Services

Day 2
As has been traditional, the second day breaks into a pair of concurrent sessions.

Track 1 begins with the NPIRI Lecture Series Winner Presentation. Rick Pomeranka, Printron, will follow with “Available Printing Plate Options and How They Affect The Print Image Discussion,” a look at the available print plate options (analog liquid photopolymer, IP photopolymer and digitally imaged sheet photopolyer) and how variables in a print plate package like plate material, thickness, cushioning materials and cylinder construction impact the printed image.

Grant Shouldice, Flint Group, will discuss “Advances in Energy Curable Printing Inks for Alterntive Energy Source,,” an analysis of how alternative sources of light energy have become a viable and economical technology for offset printing process, and how it is now possible to optimize the chemistry and process in order to produce inks for packaging and even low migration inks for primary food packaging using alternative energy sources.

Brett Beauregard, Huntsman, will discuss “TIO2 Selection Criteria,” and how choosing the appropriate Ti02 can have a significant performance impact on the formulation. Charlie Hsu, BASF, will close Track 1 with “A Chemical Resistant, Two-Pack Water-Based Ink System.” Mr. Hsu will discuss the development of a novel two-pack, dispersion/crosslinking system as the basis for a waterborne ink system that meets the performance requirements of the high resistance label and packaging market with a favorable toxicity profile and long pot life.

Track 2 looks at regulatory issues, beginning with Catherine Nielsen, Keller and Heckman, who will discuss “Food Packaging Regulations and the Printing Ink Manufacturer,” a look at how the Federal Food and Drug Administration regulations apply to food packaging and what that means for ink manufacturers, substrate suppliers and printers.

“Risk Analysis in the Global Food Contact Supply Chain – An Industry Perspective,” presented by Jim Huang, Bemis, talks about the FDA Food Safety Modernization Act and the Global Food Safety Initiative has created new regulatory challenges for the converting industry and its suppliers.

“Regulatory Update for Ink Manufacturers,” by Cheryl Falvey, Crowell & Moring LLP, provides an overview on new, pending and existing regulations affecting the ink manufacturers. “Sustainability Drivers,” discussed by Jeff Wooster, Dow Chemical Company, will offer insights into sustainability.
Jon Hellerstein, MWV, will conclude Track 2 with “GHS Implementation 2013,” an overview on GHS.

The second day will conclude with the annual Golf Outing, Reception & Awards Dinner in conjunction with NAPIM’s Open Board Dinner.

Day 3

The Oct. 4 session focuses on with New Technology Innovations. Tom Dunn, Flexpacknology, opens this session with “Good Manufacturing Practices and the Food Packaging Supply Chain.” Mark Bohan, Printing Industries of America, follows with “New Press Technology,” a look at how innovative technologies are changing the way customers print.

I will lead the next presentation, “The “Conductive Inks Panel. Printed electronics are beginning to reach the market. For printed electronics manufacturers, conductive inks are key to enhancing the performance of their products, and there are a wide range of materials - metallics, carbon nanotubes, nanomaterials, graphene and others - to choose from. I will be joined by three panelists: Darren Bianchi, president, NanoGap USA; Richard Morris, business development, representing Si-Cal Inc., PChem Associates and TouchCode; and Kody Osato, marketing manager, Toyo Ink America, LLC, Advanced Materials Division.

Tucker McNeil, MWV, will then offer his insights into “Packaging Satisfaction Survey.”

Brian Ashe, X-Rite, Inc., closes the conference with “Color in a Digital World,” a demonstration of color in the digital age though the use of the Cloud.